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19-1463; Rev 2; 10/00
ATION
EVALU
AVAIL
KIT
ABLE
+3.6V, 1W Autoramping Power
Amplifier for 900MHz Applications
General Description
The MAX2235 low-voltage, silicon RF power amplifier
(PA) is designed for use in the 900MHz frequency band.
It operates directly from a single +2.7V to +5.5V supply,
making it suitable for use with 3-cell NiCd or 1-cell Li-Ion
batteries. The device delivers +30dBm (1W) typical out-
put power from a +3.6V supply or +28dBm from a +2.7V
supply.
The MAX2235’s gain is adjustable over a 37dB range.
A power-control pin controls gain and bias to maintain
optimum efficiency, even at lower output power levels,
thus extending the operating life of the battery. At
+30dBm output power, efficiency is typically 47%. An
additional power-saving feature is a shutdown mode
that typically reduces supply current below 1μA.
A key feature of this PA is its autoramping capability.
During turn-on and turn-off periods, the RF envelope is
controlled to approximate a raised cosine on the rising
and falling edge, thereby minimizing transient noise
and spectral splatter. The ramp time is set by selecting
the value of an external capacitor.
The MAX2235 is intended for use in constant envelope
applications such as AMPS, two-way paging, or FSK-
Features
o 800MHz to 1000MHz Operation
o High Output Power at 836MHz
+32.5dBm at +5.0V
+30dBm at +3.6V
+29dBm at +3.0V
+28dBm at +2.7V
o +2.7V to +5.5V Single-Supply Operation
o Automatic Power-Up/Power-Down Ramp
o Direct On/Off Keying (OOK) without Intersymbol
Interference or VCO Pulling
o 37dB Power-Control Range
o 47% Efficiency
o <1μA Supply Current in Shutdown Mode
o Small 20-Pin TSSOP Package with Heat Slug
Ordering Information
based communications in the 900MHz ISM band. The
device is available in a thermally enhanced 20-pin
TSSOP package with a heat slug.
PART
MAX2235EUP
TEMP. RANGE
-40°C to +85°C
PIN-PACKAGE
20 TSSOP-EP
900MHz ISM-Band Applications
Two-Way Pagers
Analog Cellular Phones
Applications
TOP VIEW
Pin Configuration
Microcellular GSM (Power Class 5)
Wireless Data Networks
Functional Diagram
RFIN 1
GND 2
V CC 3
V CC 4
20 GC
19 SHDN
18 GND
17 GND
V CC
V CC V CC
V CC
V CC 5
MAX2235
16 RFOUT
RAMP
11
4
3
5
8, 9
GND 6
GND 7
15 RFOUT
14 GND
REF
SHDN
GC
12
19
20
BIAS
MAX2235
RFOUT
15, 16
V CC 8
V CC 9
GND 10
13 GND
12 REF
11 RAMP
RFIN
1
VGA
TSSOP-EP
NOTE: THE GROUND OF THE OUTPUT STAGE IS CONNECTED TO THE
2
GND
6, 7, 10
GND
13, 14, 17, 18, SLUG
GND
UNDERSIDE METAL SLUG.
NOTE: SOLDER UNDERSIDE OF METAL SLUG TO BOARD GND PLANE.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
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